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First Name: Last Name: Company Name: E-Mail Address: Verify E-Mail Address: Contact Number: Contact Address: street address: address line2 Select State----------------------------Outside US----------------------------AlabamaAlaskaArizonaArkansasCaliforniaColoradoConnecticutDelawareFloridaGeorgiaHawaiiIdahoIllinoisIndianaIowaKansasKentuckyLouisianaMaineMarylandMassachusettsMichiganMinnesotaMississippiMissouriMontanaNebraskaNevadaNew HampshireNew JerseyNew MexicoNew Yorknorth Carolinanorth DakotaOhioOklahomaOregonPennsylvaniaRhode IslandSouth CarolinaSouth DakotaTennesseeTexasUtahVermontVirginiaWashingtonWest VirginiaWisconsinWyoming City State / Province / Regions Select Country----------------------------United StatesUnited KingdomPhilippines----------------------------AfghanistanAlbaniaAlgeriaAndorraAngolaAntigua and BarbudaArgentinaArmeniaAustraliaAustriaAzerbaijanBahamasBahrainBangladeshBarbadosBelarusBelgiumBelizeBeninBhutanBoliviaBosnia and HerzegovinaBotswanaBrazilBrunei DarussalamBulgariaBurkina FasoBurmaBurundiCambodiaCameroonCanadaCape VerdeCentral African RepublicChadChileChinaColombiaComorosCongoDemocratic Republic of the CongoCosta RicaCôte d'IvoireCroatiaCubaCyprusCzech RepublicDenmarkDjiboutiDominicaDominican RepublicEast TimorEcuadorEgyptEl SalvadorEnglandEquatorial GuineaEritreaEstoniaEthiopiaFijiFinlandFranceGabonGambiaGeorgiaGermanyGhanaGreat BritainGreeceGrenadaGuatemalaGuineaGuinea-BissauGuyanaHaitiHondurasHungaryIcelandIndiaIndonesiaIranIraqIrelandIsraelItalyJamaicaJapanJordanKazakhstanKenyaKiribatinorth KoreaSouth KoreaKuwaitKyrgyzstanLaosLatviaLebanonLesothoLiberiaLibyaLiechtensteinLithuaniaLuxembourgMacedoniaMadagascarMalawiMalaysiaMaldivesMaliMaltaMarshall IslandsMauritaniaMauritiusMexicoMicronesiaMoldovaMonacoMongoliaMoroccoMozambiqueMyanmarNamibiaNauruNepalThe NetherlandsNew ZealandNicaraguaNigerNigerianorthern IrelandnorwayOmanPakistanPalauPalestinian StatePanamaPapua New GuineaParaguayPeruPhilippinesPolandPortugalQatarRomaniaRussiaRwandaSt. Kitts and NevisSt. LuciaSt. Vincent and The GrenadinesSamoaSan MarinoSão Tomé and PríncipeSaudi ArabiaScotlandSenegalSerbia and MontenegroSeychellesSierra LeoneSingaporeSlovakiaSloveniaSolomon IslandsSomaliaSouth AfricaSpainSri LankaSudanSurinameSwazilandSwedenSwitzerlandSyriaTaiwanTajikistanTanzaniaThailandTogoTongaTrinidad and TobagoTunisiaTurkeyTurkmenistanTuvaluUgandaUkraineUnited Arab EmiratesUnited KingdomUnited StatesUruguayUzbekistanVanuatuVatican CityVenezuelaVietnamWalesWestern SaharaYemenYugoslaviaZaireZambia Postal / Zip Code Country Device Name: Will you be providing the test program?   yes   no What tester platform was the test program written on? Upload the test program if available. Choose a file to upload: Additional information not covered in the form but relevant to your request of quotation.

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Wafer Sort 1. Device Name:   2. Wafer Size:   3. Die Size:  X=  Y=  4. GDPW:   5. Test Hardware and Software Development Required?  yes   no   6. Test Plans will be supplied?  yes   no   7. Datasheet will be supplied?  yes   no   8. Wafer Samples will be provided?  yes   no    Quantity:  9. Golden Wafers and Datalog supplied?  yes   no   10. Bond Diagram will be provided?  yes   no   11. Production Wafer Sort required?  yes   no   12. For CSP/Die Sales, will we be sawing the wafers?  yes   no    If yes, can we saw before test?  yes  no  note: We will use our mounting process unless otherwise specified. 13. Test Hardware, will you provide the loadboard?  yes    no  14. Test Hardware, will you provide the probecard?  yes   no   If yes, what prober was probecard designed on?  What is the prober index time?   millisecond 15. Number of test sites currently being tested?  Single   Dual     Quad   note:If you are not providing the above items (loadboard, probecard), then we will have to develop/fabricate. 16. What is the temperature required? Room 25 ℃ ?  yes    no   Other temperature:  17. Test Software, will you provide the test program?  yes    no  If yes, what is the current test time?  millisecond What tester platform it was written on?  note: If you are not providing the test software, then we will have to develop. Assembly 1. Customer Job Number:   2. Device Name:   3. Device Quantity:   4. Device Number:   5. Wafer / Silicon / Die    a. ) Wafer Size:      4 inch.    6 inch.    8 inch.   Other:     b. ) Gross Die Per Wafer:     c. ) Wafer sorted or blind build?     d. ) Wafer Map Provided:      yes.    no.     e. ) What Format?     f. ) Are the Die Ink?      yes.    no.  6. Die Size:    a. ) X =      Y =     mils or mm  =      b. ) Wafer Saw Required?      yes.    no.     c. ) Street size:      d. ) Backgrind Required?      yes.    no.     e. ) Lapping required?      yes.    no.     f. ) Thickness?    mils or mm    g. ) Wafer backing materials ( metal ):  7. Package / Dimension / Leads:    a. Package Type:     b. Package Dimension:     c. Number of leads:     d. Lead Frame:      1. Material:       2. Leadfinish:       3. Any special requirements?      Specify:  8. Die Attached:    a. Package Type:     b. Package Dimension:     c. Number of leads:     d. Lead Frame:      1. Material:       2. Leadfinish:       3. Any special requirements?      Specify:  9. Marking Required:      yes.    no.     Do you require ink or laser marking?    a. Laser Marking?      yes.    no.     b. Ink Marking?      yes.    no.     c. Color?      White.    Black.     c. Any Logo requirements?      yes.    no.     e. Provide marking details, both top & bottom?      yes.    no.  10. Mount & Bond Diagrams ID:      Please provide wire bonding diagram.      Attached soft or hard copy when you submit document.    a. Special notes:            b. If not available, what is the total amount of wires required including ground bonds?   11. RoHS material required:      yes.    no.       If yes, any special requirement or vendor standard RoHS material acceptable        If special, specify    12. Molding Compound:        a. ) Post Mold Cure: Any special requirement or vendor standard acceptable?        If special, specify    13. Bake:    Any bake or dry pack requirement?         If special, specify    14. Shipping material:    Tubes or Tape & Reel or Trays?       Number of parts per reel    15. Any other requirement:    Please specify    Final Test 1. Device Name:   2. Device Number:   3. Package type:   4. Number of leads:   5. Test Hardware and Software Development Required?      yes.    no.  6. Test Plans will be supplied?      yes.    no.  7. Datasheet will be supplied?      yes.    no.  8. Device Samples will be provided?      yes.    no.     Quantity.  9. Golden Units and Datalog supplied?      yes.    no.  10. Package Outline Drawing will be provided?      yes.    no.  11. Production Final Test required?      yes.    no.  12. Test Hardware, will you provide the loadboard?      yes.    no.     If yes, what handler was loadboard designed on?   13. Test Hardware, will you provide the contactor board and test socket?      yes.    no.     If yes, what handler was contactor designed on?   14. Number of test sites currently being tested?  Single   Dual     Quad   note: If you are not providing the above items (loadboard, contactor board, test socket), then we will have to develop/fabricate 15. What is the temperature required?  a. Room 25 ℃ ? yes   no   b. Hot Temp? yes   no     Temp =   ℃  c. Cold Temp? yes   no     Temp =   ℃ 16. QA Sampling plan:    % AQL sampling  Special QA sample size: yes   no   If yes, please provide us with sample size and temperature requirements. 17. Test Software, will you provide the test program?  yes   no    If yes, what is the current test time?  millisecond   What tester platform it was written on?    note: If you are not providing the test software, then we will have to develop. 18. Any specialty test requirements?  DC test:     yes       no    Digital test:     yes       no    UIL / UIS / EAS:     yes       no    QG:     yes       no    RG / CG:     yes       no    DVDS:     yes       no    Other test, please specify:

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